Intel careers – page 9
832 open roles at Intel (Technology) in Oregon, Malaysia, Arizona, paying $44.2k–$383.5k where the posting says so. Read from its own careers site. Search and filter these.
- Senior EDA Tools Hardware Engineer
- CPU Physical Design Engineer
- Firmware and Development Tools Intern
- AI Software Engineering - Workloads Validation Intern
- AI Frameworks Intern
- GPU Software Development Engineer
- Microarchitecture and Design Engineer - AI SoC
- Pre-Silicon SoC Validation - Technical Lead
- AI Frameworks Engineer - Intern
- Construction Project Manager
- Compiler Engineering Intern
- Module Development Defect Metrology Engineer
- Sr. EDA Tools Engineer - PERC ESD
- GPU Software Engineer
- Sales Account Manager
- Advanced Packaging TD Plating Module Engineer
- Ocotillo Technology Fabrication Senior Lithography Reticle Engineer
- Senior AI Systems and Solutions Architect – Agentic AI and CPU Host
- Senior Ethernet Product Manager
- Graduate Talent (E-core CPU Physical Design)
- E-Core CPU Design Automation Engineer
- Packaging Module Development Engineer
- E-Core CPU Design Automation Engineer
- Graduate Talent (Software Application Development Engineer)
- Graduate Talent (Software Application Development Engineer)
- Construction Project Design Manager (Contract)
- GPU Software Development Engineer
- E-Core (Atom) CPU Layout Design Engineer
- E-Core (Atom) CPU Layout Design Engineer
- Module Engineering - PhD Intern
- GPU Software Performance Intern
- Intern C++ Developer - Graphics Compute Driver (AI, HPC)
- Defect Characterization Low Yield Analysis Engineer
- Data Science and Analytics - PhD Intern
- Intel Foundry Principal Engineer Overlay Development Engineer - Lithography
- Packaging Process Development Engineer
- Memory Circuit Design Engineer
- CPU Clock Design Engineer
- Analytical Chemistry Lab Technician
- Product Failure Analysis Engineer - SCAN Design for Test
- Module Engineer On-Shift (MEOS) – Day Shift (7)
- Senior Wet Etch Manufacturing Development Engineer
- Formal Verification Engineer
- Advanced Packaging Materials Sr. Commodity Manager
- Logistics Operations Manager (Transportation) (Contract)
- Supplier Management: Substrate Tier 2/3
- Packaging Module Development Engineer
- HPC System Architecture
- (Epi) - Module Development Engineer - (PhD Intern)
- Sr Staff Substrate Yield Lead