FIRSTHANDJobs straight from the source

Intel careers – page 9

832 open roles at Intel (Technology) in Oregon, Malaysia, Arizona, paying $44.2k–$383.5k where the posting says so. Read from its own careers site. Search and filter these.

  1. Senior EDA Tools Hardware Engineer
    Intel · US California Santa Clara · $141.9k–$269.1k
  2. CPU Physical Design Engineer
    Intel · US, Texas, Austin · $105.7k–$200.3k
  3. Firmware and Development Tools Intern
    Intel · PRC Shanghai
  4. AI Software Engineering - Workloads Validation Intern
    Intel · Poland, Gdansk · PLN 68.9k
  5. AI Frameworks Intern
    Intel · Poland, Gdansk · PLN 68.9k
  6. GPU Software Development Engineer
    Intel · India, Bangalore
  7. Microarchitecture and Design Engineer - AI SoC
    Intel · India, Bangalore
  8. Pre-Silicon SoC Validation - Technical Lead
    Intel · India, Bangalore
  9. AI Frameworks Engineer - Intern
    Intel · Poland, Gdansk · PLN 68.9k
  10. Construction Project Manager
    Intel · Israel Haifa
  11. Compiler Engineering Intern
    Intel · PRC, Shanghai
  12. Module Development Defect Metrology Engineer
    Intel · US, Oregon, Hillsboro · $155.5k–$219.6k
  13. Sr. EDA Tools Engineer - PERC ESD
    Intel · US Oregon Hillsboro · $149.6k–$284.6k
  14. GPU Software Engineer
    Intel · US, California, Folsom · $111k–$211.2k
  15. Sales Account Manager
    Intel · US, California, Santa Clara · $215.2k–$303.8k
  16. Advanced Packaging TD Plating Module Engineer
    Intel · US, Oregon, Hillsboro · $133.8k–$255.2k
  17. Ocotillo Technology Fabrication Senior Lithography Reticle Engineer
    Intel · US, Arizona, Phoenix · $103.7k–$198.8k
  18. Senior AI Systems and Solutions Architect – Agentic AI and CPU Host
    Intel · US Oregon Hillsboro · $195.2k–$315.5k
  19. Senior Ethernet Product Manager
    Intel · US Oregon Hillsboro · $161k–$265.9k
  20. Graduate Talent (E-core CPU Physical Design)
    Intel · Malaysia, Penang
  21. E-Core CPU Design Automation Engineer
    Intel · Malaysia, Penang
  22. Packaging Module Development Engineer
    Intel · Malaysia, Kulim
  23. E-Core CPU Design Automation Engineer
    Intel · Malaysia, Penang
  24. Graduate Talent (Software Application Development Engineer)
    Intel · Malaysia Penang
  25. Graduate Talent (Software Application Development Engineer)
    Intel · Malaysia, Penang
  26. Construction Project Design Manager (Contract)
    Intel · Malaysia, Kulim
  27. GPU Software Development Engineer
    Intel · India, Bangalore
  28. E-Core (Atom) CPU Layout Design Engineer
    Intel · Malaysia Penang
  29. E-Core (Atom) CPU Layout Design Engineer
    Intel · Malaysia Penang
  30. Module Engineering - PhD Intern
    Intel · US, Oregon, Hillsboro · $120.9k
  31. GPU Software Performance Intern
    Intel · Poland, Gdansk · PLN 87.5k
  32. Intern C++ Developer - Graphics Compute Driver (AI, HPC)
    Intel · Poland, Gdansk · PLN 68.9k
  33. Defect Characterization Low Yield Analysis Engineer
    Intel · US, Arizona, Phoenix · $133.8k–$188.9k
  34. Data Science and Analytics - PhD Intern
    Intel · US, Oregon, Hillsboro · $137k
  35. Intel Foundry Principal Engineer Overlay Development Engineer - Lithography
    Intel · US, Oregon, Hillsboro · $211.4k–$298.4k
  36. Packaging Process Development Engineer
    Intel · US, Arizona, Phoenix · $99k–$188.9k
  37. Memory Circuit Design Engineer
    Intel · US, Texas, Austin · $141.9k–$269.1k
  38. CPU Clock Design Engineer
    Intel · US Texas Austin · $105.7k–$269.1k
  39. Analytical Chemistry Lab Technician
    Intel · US, Arizona, Phoenix · $60.5k–$116.6k
  40. Product Failure Analysis Engineer - SCAN Design for Test
    Intel · US, Oregon, Hillsboro · $141.9k–$269.1k
  41. Module Engineer On-Shift (MEOS) – Day Shift (7)
    Intel · US, Arizona, Phoenix · $85.2k–$162.5k
  42. Senior Wet Etch Manufacturing Development Engineer
    Intel · US Oregon Hillsboro · $155.5k–$298.4k
  43. Formal Verification Engineer
    Intel · Israel Haifa
  44. Advanced Packaging Materials Sr. Commodity Manager
    Intel · Japan Tokyo
  45. Logistics Operations Manager (Transportation) (Contract)
    Intel · Malaysia, Penang
  46. Supplier Management: Substrate Tier 2/3
    Intel · Japan, Tokyo
  47. Packaging Module Development Engineer
    Intel · Malaysia, Kulim
  48. HPC System Architecture
    Intel · US California Santa Clara · $220.9k–$311.9k
  49. (Epi) - Module Development Engineer - (PhD Intern)
    Intel · US, Oregon, Hillsboro · $120.9k
  50. Sr Staff Substrate Yield Lead
    Intel · US, Arizona, Phoenix · $180.8k–$255.2k

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