Micron careers – page 2
3,516 open roles at Micron (Technology) in Boise, Taichung, Fab 10n, paying $47.5k–$421k where the posting says so. Read from its own careers site. Search and filter these.
Micron is a global leader in memory and storage, powering AI and compute-intensive applications from cloud to edge with innovative semiconductor solutions. micron.com
- Metallization Equipment (Shift) Engineer
- Semiconductor Process Engineer - Photo
- Principal Engineer, Design
- Facilities Electrical Engineer
- Sr Layout Engineer-DPG-LPDDR
- Principal Engineer, ESSD Firmware Developer
- Staff Engineer, ESSD Firmware
- Senior Principal ER Advisor & Investigator – Japan
- Senior Engineer - Electrical Failure Analysis, NTI
- RDA Operation Engineer
- NAND Designer / Layout
- NAND Designer / Layout
- NAND Designer / Layout
- Probe HBM application integration engineer
- Test Equipment Technician
- Sr Engineer, FACILITY MECHANICAL
- Staff Engineer, CAD
- Construction Project Manager - Delivery Controls
- Sr.Manager, MOD SSD Manufacturing
- MTS Package engineer - ASIC package design, logic integration and design rules
- New College Grad - NAND & SSD Applications Engineer
- New College Grad - Product Applications Engineer
- RAM RDA Process Engineer
- Senior Product Owner, Smart Mfg & AI
- Engineer - HIG HBM - PE Design Validation
- Intern - Data Science
- Ate Process Engineer – WP
- Intern - Strategic Category Analyst
- MGR, TAIWAN FE MFG PMO TBO - Office Layout
- Sr Principal Technical Program Manager, CAD Engineering and AI Initiatives
- Industrial Engineer
- Industrial Engineer
- HBM SoC Physical Design Engineer
- Principal Global Account Manager, Storge Accounts
- Senior Engineer Design
- Engineer - Life Safety Systems & Telecommunications
- Principal Design Engineer, HBM Architecture
- Intern - Embedded Software Engineer
- Night Shift Process Engineer - Thin Films
- Sr/ Staff Design Engineer/Architect(Datapath), HBM
- Senior Engineer, FE Central QA
- Central Planning Modeling Engineer
- FE OCT CPEE Operations Leader
- Intern - Memory Performance and Power Modeling
- CMOS Device Integration Team - Staff Engineer
- Principal Engineer HBM Tapeout Execution & Release Coordination
- High Bandwidth Memory Design Architect - E1 to SMTS
- NCG Supply Chain Planner
- Change Management Engineer
- Assembly Process Technician