Micron careers – page 6
3,545 open roles at Micron (Technology) in Boise, Taichung, Fab 10n, paying $47.5k–$421k where the posting says so. Read from its own careers site. Search and filter these.
Micron is a global leader in memory and storage, powering AI and compute-intensive applications from cloud to edge with innovative semiconductor solutions. micron.com
- DRAM Principal Design Verification Engineer
- LPDRAM Product Engineer
- Senior DRAM Systems Architecture
- Fab 10 Facilities Senior Mechanical Engineer
- Staff / Senior Engineer – Firmware Development
- Graduate Engineering Technician
- SR AI Engineer , SMAI
- Senior Data Scientist, Global Operations Intelligence, SMAI
- Senior Engineer, Firmware Test (SSD)
- Engineer, Firmware Test (SSD)
- Senior Engineer STPG Product Engineering - Probe
- Engineer/Senior, Firmware Test (SSD)
- Staff/Principal Engineer, NAND Product Engineering
- Senior Engineer, PYE (NPI)
- Engineer, SSD Customer Validation
- Senior Principal, SMAI, Cost & Procurement
- Senior Engineer, Firmware Development (SSD)
- Senior Engineer, Firmware Development (SSD)
- Senior Engineer, Firmware Development (SSD)
- Staff Engineer, Firmware Development (SSD)
- OCT PCVD Mfg. Alignment (MA) Principal Engineer
- Staff Engineer, Industrial
- Engineer, Fecos Cpie Pi
- Senior Engineer - NAND Cell Reliability
- Engineer, CE Pye
- Senior Engineer, Process Integration, NAND, NTI
- Staff Engineer, MCT Operations Quality
- Principal Engineer - Firmware Development (SSD)
- Senior / Staff Engineer - Firmware Development (SSD)
- Senior Engineer, Firmware Test (SSD)
- Engineer, Firmware Test (SSD)
- Sr AI Engineer, SMAI
- Staff Specialist, Physical Security.
- Senior Engineer, TEM
- Staff NPO Product Manager (HBM)
- Senior Member of Technical Staff (SMTS) – 3D NAND Process Integration
- Sr Program Manager, Global Quality
- Senior Engineer, Front End Labor Data Engineering
- Principal AI Engineer, SMAI
- Staff Engineer, HIG-HBM Product Engineering (Media Health Manufacturing)
- Engineer, MDE NAND
- Data Scientist, Smai
- Member of Technical Staff, Product Integration Lead, HIG High Bandwidth Memory
- Staff Program Manager, MSH PMO
- Senior/Staff Photolithography Process Development Engineer
- Senior/ Staff Engineer, Equipment Development, DIFI
- Senior Engineer – PD Adv Wet Process
- Product Engineer (Advance Data Analytics), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering
- Senior Engineer, NAND PI
- Staff Engineer, PD Adv NAND Dry Etch