Photo/Metrology Equipment Engineer ECHO Fab

NXP Semiconductors · Chandler

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Equipment Engineering Role in ECHO Fab: Skills in Equipment Knowledge and Understanding; Safety & Compliance; Problem‑Solving Systems (WSS, troubleshooting trees); Root Cause Analysis; Equipment Fundamentals; Managing Sustaining Metrics (availability, alarms,  scrap); OEE System Thinking; Escalation Discipline; FDC / Advanced Analytics & Scripting;  FMEA / DFMEA Facilitation  MTBF / MTTR Analysis; Tool Acceptance &  Automation / MES Familiarity; Standard Work & 5S; Results Orientation / KPIs Mindset; Written/Verbal Communication Skills; Influencing up/down & Stakeholder Alignment; Vendor / Partner Management; Audit & Customer‑Facing Presence; Cost Literacy; Coaching; Prioritization; Delegation; Collaboration & Teamwork; Bias for Action with Rigor; Adaptability & Learning Mindset; Manage Ambiguity; Material Science Fundamentals.

Primary Responsibilities:

• Responsible for multiple processes and tool ownership in a high-volume manufacturing facility
• Identify and reduce sources of variation, implementing zero defect processes, reducing defectivity, defining tool qualification/PM procedures, improving tool utilization and availability, reducing cycle time, identifying, and qualifying new tools, and supporting development or transfer activities.
• Sustaining – lead troubleshooting efforts, manage critical part inventory, direct supplier activities, responsive to SPC/ FDC excursions, writing specifications, training maintenance techs…
• Improving – forming/executing plans for continuous improvements, implementing hardware/software upgrades, developing preventative actions to SPC/ FDC excursions…
• Expanding – increasing tool capabilities/throughput/availability, determining new sourcing for parts/service/toolsets, installation/qualification of new equipment/components

Qualifications:

• Bachelor’s degree or higher in a technical discipline is required, prefer mechanical or industrial engineering or similar.
• Experience in one of the following area’s Photo, Metrology or Plating tools Preferred
• Manufacturing experience (semiconductor preferred) in process or equipment engineering over a variety of toolsets.
• Ability to interact professionally with manufacturing and process engineering to effectively understand problems and efficiently resolve them.
• Ability to generate, analyze, and interpret equipment performance data and produce a timely action plan to resolve recurring equipment failures.
• Demonstrated presentation skills with ability to present complex datasets and equipment problems/ solutions to diverse audiences.
• Competent in troubleshooting problems and capable of applying logic to identify and technical skills to understand actions needed to implement/verify the repair.
• Ability to deal with multiple issues and shifting priorities.
• Strong verbal and written communication skills. Candidate will be called upon to train others and write clear procedures.
• Self-motivated; able to take initiative and effectively prioritize work for self.
• Participating in and/or leading cross-functional teams fostering collaboration to achieve a specific goal.
• A strong desire to help create a positive, winning, world class working environment.
• Safety and Quality minded approach and work habit
• Must be able to obtain and maintain an Export Control Clearance

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

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