Assembly Handling Systems Development Engineer

Intel · Kulim

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Job Details:

Job Description: 

Become a member of the Assembly Test Technology Development in the Media, Inspection, Handling Systems, and Laser (MIHL) Module engineering team. The role is located in Kulim as a Handling Systems development engineer leading the development and deployment of Intel's advanced chip packaging process technology.


In this position, you will be directly responsible for developing material handling technology involving high accuracy and high-speed pick-n-place systems for next generation semiconductor packaging technology. Your responsibilities include, but are not limited to:


Qualifications:

Minimum Qualifications:


Preferred Qualifications:

Job Type:

Experienced Hire

Shift:

Shift 1 (Malaysia)

Primary Location: 

Malaysia, Kulim

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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