PIM (Si Gel Filled) Power Module Development Engineer
onsemi · Shenzhen
- New package technology and platform module development (Si-gel filled module).
- Technical leadership on new power module technology and enabling technology for automotive/industrial application.
- Technical interface for package team, communication with business unit, marketing, device TD, quality/reliability, manufacturing and application team.
- Package/design review for new package development, on-tme release with the first pass success (qualification).
- Present technical finding, design review and recommendation to stakeholders and management.
- Lead package related failure analysis, reliability testing and debug package issues.
- Participate in customer meeting, provide technical clarification and support failure investigation.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here: