Senior Packaging Engineer

Microsoft · Pulau Pinang

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Overview

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for engineers to help achieve that mission.

The Compute Silicon & Manufacturing Engineering (CSME) organization within SCHIE is responsible for design, development, manufacturing and packaging of Microsoft's state-of-the-art computer chips, notably the Azure Cobalt. Our solutions provide sustainable strategic advantages to Microsoft and enable our customers to achieve more.

As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the Silicon Manufacturing and Product Engineering (SMPE) team is instrumental in defining and elivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.

 We are looking for a Packaging Technology & Manufacturing Engineer to join the team to support our mission as a key role in areas related to silicon packaging manufacturing operations, quality and reliability.

#SCHIE #CSME #SMPE



Responsibilities

The candidate for this position will be expected and able to complete the following responsibilities:

The Packaging Engineer will be responsible for providing expertise, insight, and support to the Silicon development team through the entire life cycle of the product.  In this role, you will be responsible for supporting the design and implementation of new custom Silicon devices, evaluation and recommendation of new packaging technology, Substrate design support, device/package qualification, supplier assessment, manufacturing bring up, and driving quality/reliability in development and production.

Specific responsibilities to include:

Package Development & Production Ramp

High-Volume Manufacturing & Sustaining

Quality & Supplier Management



Qualifications

Required Qualifications:

  1. BS/MS/PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Packaging Engineering, or a related technical discipline.
  2. Significant industry experience in semiconductor packaging, assembly, process engineering, package development, or manufacturing.
  3. Demonstrated experience taking advanced package technologies from development through qualification and high-volume production.
  4. Strong experience working directly with OSATs and external manufacturing partners.
  5. Demonstrated ability to solve complex package/process/yield/reliability issues using structured technical analysis.
  6. Strong communication skills with the ability to influence suppliers and cross-functional engineering organizations.
  7. The ideal candidate will bring strong expertise in:
    1. Advanced semiconductor packaging technologies and manufacturing processes.
    2. Package architecture and package design fundamentals.
    3. Assembly technologies, materials, process integration, and manufacturing controls.
    4. OSAT manufacturing and supplier technical management.
    5. Package design-for-manufacturing and design-for-reliability.
    6. Product introduction, qualifications, production ramp, and high-volume manufacturing.
    7. Yield analysis, process capability, excursion management, root-cause analysis, and corrective actions.
    8. Package reliability and failure mechanisms.
    9. Cross-functional technical leadership across silicon, package, test, quality, manufacturing, and system teams.

Screening Requirements


This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.



Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.

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