Lead Embedded Software Engineer

Dyson · Shenzhen

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The Role:


As a Lead Embedded Software Engineer , you’ll lead the design and optimisation of embedded systems for connected electronic products, defining robust BLE/Wi-Fi integration and guiding Joint Development Manufacturer (JDM) suppliers in software delivery. You’ll work with business teams to refine requirements, define high-level architecture, and proactively size and present alternative solutions to stakeholders—ensuring only the best options advance.


You’ll collaborate with hardware teams on MCU selection, participate in DFMEA, and define both software safety and security requirements, developing resilient and secure software architecture throughout. From concept to production, you’ll provide technical solutions, build relationships across functions and partners, and continually review current practices—proposing and implementing initiatives that improve efficiency and effectiveness.


This role will be based at the Dyson Shenzhen Office and/or JDM supplier sites, depending on project needs. The successful candidate should be willing to travel and work onsite at JDM locations as required to support architecture reviews, technical alignment, development activities, integration, and product delivery.


Key Responsibilities


Requirements

Education & Experience


Technical Skills


Leadership & Communication


Process & Quality

Committed to reviewing practices and driving continuous process improvements.


Dyson is an equal opportunity employer. We know that great minds don’t think alike, and it takes all kinds of minds to make our technology so unique. We welcome applications from all backgrounds and employment decisions are made without regard to race, colour, religion, national or ethnic origin, sex, sexual orientation, gender identity or expression, age, disability, protected veteran status or other any other dimension of diversity.

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