Senior Packaging Development Engineer - Leadframe Package/Ceramic

Texas Instruments · Malacca

Packaging Engineer

About TI

Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping about 100,000 customers transform the future, today. We’re committed to building a better future – from the responsible manufacturing of our semiconductors to caring for our employees, to giving back inside our communities and developing great minds. Put your talent to work with us – change the world, love your job!

About the job

As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industry’s top engineering minds at your disposal. TI’s corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect, dignity, kindness and courtesy.

Put your talent to work with us as a Packaging engineer – change the world, love your job!

Responsibilities include:

Hands on or optimizing FOL process such as Face2Face Flip Chip & Reflow process as well as swivel molding characterization for dual side cooling MCM package
Defining simplified FOL and EOL manufacturing process sequence for power stage package
Managing multiple new product executions starting from kick-off, product prototyping, characterization, learning cycles, and qualifications until product released with engineering approach such as JMP analysis, FMEA, control plan, etc.
Collaborate closely with factory operations teams to meet manufacturing indices, quality standards, and cost entitlements
Engaging with global package platform and emerging technology team to execute differentiated technology roadmaps to establish process capabilities in front of needs
Enabling TI MCM modules package competitiveness through adopting the industry latest greatest capabilities and maximize package design flexibility for adapting the latest technology.
Work with multi function to enable stress modeling to understand the package design weak point and define the contingency plan to overcome it.

Why TI?

Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here

About Texas Instruments

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.

Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.

If you are interested in this position, please apply to this requisition.

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