External Manufacturing Staff Operation Engineer
onsemi · Suzhou
onsemi is currently seeking an experienced Process Engineer to support and optimize wafer bumping & DPS manufacturing processes for high-volume semiconductor production. The successful candidate will be responsible for process development, process characterization, yield improvement, defect reduction, equipment qualification, and manufacturing support while ensuring compliance with quality and reliability requirements. Relevant bumping experience may include UBM, photolithography, plating, reflow, wafer thinning, WLCSP, Cu pillar, solder bump, micro-bump, or advanced packaging technologies.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
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