Solutions Engineer - AE

Cadence · United States · $162,400–$301,600 (stated in the posting)

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At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

Solutions Architect Engineer (AE)

Advanced Packaging, 3D-IC and SI/PI

Location

United States (Remote or Hybrid)

Job Summary

Cadence is seeking a highly motivated and experienced Solutions Application Engineer to support customers developing next-generation advanced packaging solutions, including 2.5D, 3D-IC, chiplet-based architectures, AI/HPC packages, and heterogeneous integration technologies.

The successful candidate will work directly with leading semiconductor companies, OSATs, foundries, and system companies to deploy and optimize Cadence Advanced Package 3D-IC associated design flows. This role combines technical expertise, customer engagement, solution development, and collaboration with R&D to drive customer success and product adoption.

Responsibilities

• Provide technical leadership and application support for Cadence 3D-IC design solutions.
• Assist customers with advanced package architecture, design implementation, and methodology development.
• Develop and demonstrate complete packaging workflows for:
  • Organic substrates
  • Silicon interposers
  • Wafer Level Packaging
  • 2.5D and 3D-IC integration
  • Chiplet-based package architectures
• Support customer evaluations, proof-of-concepts, benchmarks, and production deployments.
• Deliver technical presentations, product demonstrations, workshops, and training sessions.
• Collaborate with sales teams to identify opportunities and provide technical pre-sales support.
• Work closely with R&D to communicate customer requirements, enhancement requests, and new technology needs.
• Support design-signoff methodologies including:
  • DRC/LVS
  • Connectivity verification
  • Electrical rule checking
  • Thermal analysis
  • Signal Integrity (SI)
  • Power Integrity (PI)
• Develop best practices, application notes, reference flows, and customer success methodologies.
• Assist in defining future product direction for advanced packaging, 3D-IC, and chiplet technologies.

Required Qualifications

• Bachelor’s degree (Masters preferred) in Electrical or Electronics Engineering, or related discipline with
• 10+ years of experience in semiconductor packaging, IC packaging, PCB, substrate, or interposer design.
• Strong knowledge of:
  • Advanced package design methodologies
  • 2.5D and 3D-IC integration
  • Chiplet-based architectures
  • Package manufacturing and assembly processes
  • High-speed signal design
  • Power delivery networks
• Experience performing package layout, routing, constraint management, and package signoff.
• Solid understanding of package stackups, bump planning, escape routing, and substrate technologies.
• Excellent customer-facing communication and presentation skills.
• Ability to work independently while collaborating across global teams.

Preferred Qualifications

• Experience with Cadence Integrity 3D-IC Platform.
• Experience with Cadence Sigrity and Clarity 3D Solver.
• Hands-on experience with Cadence Allegro X APD.
• Knowledge of UCIe, HBM, AI accelerator packaging, and heterogeneous integration.
• Experience supporting foundry and OSAT design flows.
• Understanding of semiconductor assembly, reliability, and manufacturing processes.

Travel Expectations: Approximately 2% to 5% travel, depending on customer demand and business needs.

The annual salary range for California is $162,400 to $301,600. You may also be eligible to receive incentive compensation: bonus, equity, and benefits. Sales positions generally offer a competitive On Target Earnings (OTE) incentive compensation structure. Please note that the salary range is a guideline and compensation may vary based on factors such as qualifications, skill level, competencies and work location. Our benefits programs include: paid vacation and paid holidays, 401(k) plan with employer match, employee stock purchase plan, a variety of medical, dental and vision plan options, and more.

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