Member of Technical Staff - Thin Films Engineer

Intel · Hillsboro · $133,800–$255,200 (stated in the posting)

Job Details:

Job Description:

Organization Overview 

Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), advancing technology nodes and process capability from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers. 

About This Role

Join Intel's Manufacturing Development and Customer Engineering (MDCE) team as a Senior Engineer driving process innovation across Intel's most advanced semiconductor technologies in volume manufacturing. You will spearhead the development, optimization, and manufacturability of critical thin film deposition processes, ensuring seamless transitions from early development to high-volume production while meeting Intel foundry customer requirements.

Your Mission 

Lead thin film process excellence across CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal, and/or treatment technologies. Operating at the nexus of Technology Development and High-Volume Manufacturing, you will drive breakthrough solutions for Intel 18A, Intel 3, 12nm, and next-generation technology nodes.

Key Responsibilities

Process Innovation & Excellence

Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules

Drive defectivity reduction and uniformity improvements through systematic process enhancement

Lead technical problem resolution and deliver solutions that meet aggressive technology node targets

Optimize equipment performance working with internal teams and key suppliers

Strategic Technical Leadership

Align technical vision with customer requirements and business objectives

Synthesize complex technical data to formulate and execute strategic responses

Own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines

Deliver rapid execution of innovative solutions to meet challenging development timelines

Cross-Functional Partnership

Collaborate closely with Technology Development, High Volume Manufacturing, and Business Groups

Build strong relationships with Integration, Device, Yield, Quality, Reliability teams, and external suppliers

Present technical findings effectively to diverse audiences from engineering teams to executive leadership

Foster in-person collaboration to accelerate decision-making and problem resolution

Industry Leadership

Stay current with semiconductor industry trends and emerging process technologies

Drive strategic initiatives that position Intel at the forefront of manufacturing innovation

Contribute to technology roadmaps through hands-on technical expertise and market insight

What We're Looking For

Technical Excellence

Results-driven professional with exceptional technical problem-solving abilities

Proven track record of significant accomplishments across multiple technology nodes

Strong analytical skills with expertise in yield improvement, performance enhancement, and variation reduction

Deep understanding of semiconductor manufacturing strategies, fab operations, and technology transfer

Leadership Capabilities

Outstanding communication skills for presenting complex technical information to varied audiences

Self-motivated with strong initiative and ability to navigate ambiguous technical challenges

Demonstrated ability to manage multiple high-priority projects under pressure while maintaining quality focus

Experience driving clarity in complex technical situations and leading cross-functional initiatives

Industry Expertise

Comprehensive knowledge of process development, materials science, and device physics

Ability to interpret industry trends and translate market dynamics into actionable technical strategies

Experience with foundry business models and customer engagement requirements

Proven capability to work independently while managing diverse technical assignments

Qualifications:

The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field

5+ years semiconductor industry experience with strong focus on thin film deposition processes -OR- PhD and 3+ years of Industry experience

Proven experience in process development, technical leadership, and manufacturing engineering

Experience working with equipment suppliers (AMAT, LAM, ASM, TEL) on process optimization

Comprehensive fab startup experience across manufacturing, quality, RandD, and supply chain functions
Proficiency with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems

Preferred Qualifications

Doctoral degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field with research publications and patent portfolio in thin film technologies

Expertise in Gate All Around (GAA) logic technologies within semiconductor foundry environments

Proven track record delivering customized solutions across Technology Development and HVM organizations

Cross-functional leadership experience managing diverse stakeholder groups

Semiconductor foundry experience

We invite you to bring your expertise and passion to Intel, where you'll have the opportunity to grow your career, make meaningful contributions, and shape the future of technology.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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