Module Engineering - Day Shift 5 or 7

Intel · Casa Grande · $99,030–$139,810 (stated in the posting)

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Job Details:

Job Description: 

At Intel, we create world-changing technology that improves the life of every person on the planet. Intel's Foundry Technology Manufacturing business unit is at the forefront of delivering advanced packaging solutions for a broad ecosystem of global customers. We collaborate with world-class engineers, contribute to cutting-edge technology development, and directly impact the quality and performance of products that power the global tech industry. This is your opportunity to grow your career while helping define the future of foundry manufacturing.

We are seeking a Foundry Packaging Module Engineer to join our operations in Chandler, Arizona. In this role, you will develop and optimize assembly processes and equipment, applying innovative concepts to enable Intel's next-generation foundry packaging platform technologies. You will work at the intersection of engineering, manufacturing, and technology development to deliver world-class packaging solutions, evaluate silicon and package technologies under simulated field conditions, and manage raw material specifications to meet our foundry customers' unique needs.

Shift Options:

• Shift 5: Day Shift Compressed Work Week (6:00 AM – 6:00 PM; Sunday–Tuesday and alternating Wednesdays)
• Shift 7: Day Shift Compressed Work Week (6:00 AM – 6:00 PM; Thursday–Saturday and alternating Wednesdays)

Key Responsibilities:

• Process & Equipment Development: Design and develop assembly processes and hardware configurations, using novel engineering concepts to advance Intel's foundry packaging roadmap.
• Reliability & Stress Evaluation: Develop, calibrate, and maintain equipment used to evaluate silicon and packaging technologies under simulated field conditions (including thermal cycling, heat, humidity, and mechanical stress).
• Vendor & Material Qualification: Establish raw material specifications for contract assemblers and material vendors, partnering with supplier quality and procurement to enforce process compliance.
• Early Failure Detection: Create and implement new reliability screening techniques, acceleration methods, and quality screens to enable early detection of potential packaging defects.
• Process Control & Characterization: Apply Statistical Process Control (SPC) and Design of Experiments (DOE) principles to define equipment specifications, optimize yields, and document results in technical white papers.
• Design-for-Manufacturability (DFM): Ensure physical layout designs are manufacturable within foundry process flows, overseeing the full cycle of package manufacturing procedures.
• Technical Consultation: Serve as a technical resource for foundry packaging challenges, responding to customer and partner requests and providing guidance on process improvements.
• Technology Standardization: Drive standardization across product qualification frameworks and manufacturing quality systems, engaging with technology development teams to mitigate product milestone risks.

As a Successful Candidate, You Will Bring:

• Customer-Centric Mindset: Passion for understanding, consulting, and delivering highly specialized technical solutions to external foundry customers.
• Analytical Problem Solving: Analytical thinker focused on diagnosing complex mechanical, thermal, and materials-related packaging defects.
• Strong Strategic Collaboration: Highly effective at partnering across diverse matrixed teams, global engineering groups, and external supplier networks.
• Adaptability & Drive: High level of personal initiative to lead continuous improvement projects and adjust to changing product priorities.

Apply today to join Intel Arizona's Foundry Technology Manufacturing team. Collaborate with global pioneers, lead advanced reliability initiatives, and build a rewarding engineering career.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience. This Position is not eligible for Intel immigration sponsorship.

Minimum Qualifications:

• Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study with 1+ year of relevant experience. -OR- Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study.
• 6+ months of experience with Statistical Process Control (SPC)and/or Design of Experiments (DOE)principles.

Preferred Qualifications:

• 1+ years of experience:
  • Working inside a technology development or semiconductor manufacturing environment.
  • Semiconductor packaging processes, including assembly, material selection, or reliability engineering within a foundry context.

Job Type:

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Primary Location: 

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Posting Statement:

Position of Trust

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

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