Electromagnetics (EM) and Packaging Design Engineer
Texas Instruments · Dallas
We can't predict what the future holds, but we know Texas Instruments will have a part in shaping it.
Kilby Labs is the advanced R&D and product development support organization within TI chartered to define and develop new and innovative technologies and solutions in collaboration with business units and customers.
As a member of Kilby Labs you’ll have the chance to interact with many product groups and functions, work with an interdisciplinary team, and bridge from lab to fab to develop technologies to enable new markets.
About the Position
Kilby Labs is seeking a highly motivated and experienced electromagnetic modeling engineer to support various TI product development, including Silicon Photonics, RF filters and 2.5D/3D heterogeneously integrated systems. This role is responsible for the RF modeling of new technology platforms and product ideas. The role requires working extensively across other internal teams including advanced process technology development (ATD), packaging, chip design and test, and product engineering, to make innovative, high performance and cost-effective solutions. This position is ideal for individuals interested in RF design, electromagnetics, filter design, RFIC and module co-design, and advanced/heterogeneous packaging technologies. For this role we are seeking a creative problem-solver who can develop unique and breakthrough solutions.
Responsibilities may include, but are not limited to:
- Drive and execute the strategy of high frequency and high-speed interconnect simulations for various product developments.
- Lead the electromagnetic modeling needs of the team for various applications; such as advanced packages, TSVs, heterogeneously integrated 2.5D/3D systems.
- Build and analyze electromagnetic models of RF passive structures, including: filters, matching networks, baluns, couplers, RF transitions and interconnects.
- Perform electromagnetic simulations using tools such as HFSS and EMX
- With extracted S-parameters, run circuit and system-level simulations.
- Investigate RF interactions between the circuits, package structures, and passive components.
- Drawing mask layouts for test structures for proof-of-concept studies, as well as supporting technology development activities
- Evaluate design trade-offs related to performance, and manufacturability.
- Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
- We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
- Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here
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