Field Process Engineer I

Hitachi · $66,756–$91,790 (stated in the posting)

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POSITION TITLE:                             Field Process Engineer I

DIV/DEPARTMENT NAME:           Semiconductor Equipment Division (SED)

REPORTS TO:                                  Supervisor, Field Process Engineering

POSITION STATUS:                        Full-Time

WORK LOCATION:                         Scottsdale, AZ (AZ2) / Taylor, TX (AUS)

WORK STYLE DESIGNATION:     Customer Hybrid (+50% Onsite)          

WORK STYLE REQUIREMENT:    Customer Onsite – 80% / HTA Office – 20%

FLSA STATUS:                                 Exempt

TRAVEL REQUIRED:                       Up to 50%

POSITIONS SUPERVISED:             None

EXPECTED SALARY RANGE: $66,756.16 - $91,789.72

This pay range is for the position's base salary only. This position may be eligible for other compensation including incentive pay and/or allowances. Candidates will receive additional information during the interview and selection process.

POSITION SUMMARY

The Field Process Engineer I position has a position located in Scottsdale, AZ and another located in Taylor, Texas. This position supports the business objectives of HTA’s Semiconductor Equipment Division (SED) at the customer site. This position will require the employee to be at the customer site ~80% of the time.

The main objective of this position is to provide process engineering support to SED’s various customer activities and development programs associated with plasma etchers and Reactive Ion Etch (RIE) processes. Training will be given to develop specific skills and knowledge. The employee must be willing to travel to Asia for a training assignment if necessary.

The engineer should be able to independently perform tasks, understand RIE theory, work in a cleanroom environment, and interface with customers on a detailed level. The engineer is also interfacing with engineers globally so strong interpersonal skills are required.

PRIMARY RESPONSIBILITIES

{E} Essential Functions {NE} Non-Essential Functions

• Day-to-Day responsibilities include completing assigned tasks in a timely fashion, developing good customer relations through calls, and emails, troubleshooting customer process issues, working closely with the customer to understand needs and reporting back to SED; as well as managing and driving projects to closure. {E}
• Perform hands-on RIE/dry etch process troubleshooting and development.  This includes performing troubleshooting and demonstrations at the customer site, R&D of new dry etch technology trends, and meeting the objectives of customer requirements for current and future technology processes.  {E}
• Utilize analytical tools and techniques to solve process implementation issues. {E}
• Heavy use of data, analysis, design, and execution of experiments including DOE and working with code or developed code for the analysis of data. {E}
• After training, must be able to operate Hitachi plasma etch systems and all associated semiconductor metrology equipment including scanning electron microscopy, and critical dimension scanning electron microscopy. {E}
• Generate internal and external documentation for products, presentations, technical reports, and process engineering specifications. {E}
• Interface with customers regarding demonstration results, new product evaluations, training of process and/or equipment, and troubleshooting of process issues. {E}

EDUCATION, LICENSES, AND/OR CERTIFICATION REQUIREMENTS

• BS Degree in Chemical Engineering, Materials Science, Engineering Physics, semiconductor related field, or equivalent experience. 

EXPERIENCE AND TRAVEL REQUIREMENTS

• 0-2 years Plasma Etch Process Experience or semiconductor processing preferred. {NE}
• Data analysis and high level of proficiency in Microsoft Excel are needed. {E}
•  Travel to field offices in Texas for assignments in 3-6 month intervals. {E}Must be able to travel to Asia for training assignment.  {E}
• Periodic oversees business trips may be required throughout the year. {E}

SKILLS AND ABILITIES REQUIREMENTS & SAFETY REQUIREMENTS

• Strong general technical knowledge of semiconductor wafer processing.
• Fundamental understanding of and experience with Dry Etch / RIE.
• Self-motivated and show ability to adapt to changes in a fast-moving environment.
• Strong knowledge of chemistry, the ability to analyze OES data, equipment data (IE) and utilize other predictive software is required.
• Strong computer skills including Microsoft Office software competency, high level of proficiency with Microsoft Excel, Spotfire, and Python experience is preferred.
• Must have good verbal and written communication, strong analytical capabilities and be able to work in a team environment.
• Able to demonstrate project planning, execution, and leadership skills with on-time delivery of milestones.
• Strong troubleshooting skills required.
• Must be able to work in a clean room environment for extended hours with limited seating. 
• Job Related Knowledge Company training
• Additional customer specific training before site entry

Equal Opportunity Employer (EOE)

If you require reasonable accommodation in completing this application, interviewing, completing any pre-employment testing, or otherwise participating in the employee selection process, please direct your inquiries to HTA-AccommodationRequests@hitachi-hightech.com

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