Sr Principal Sourcing Manager – Silicon Technologies

Astera Labs · San Jose · $190,000–$240,000 (stated in the posting)

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Role Overview 

Astera Labs is seeking a highly experienced Sr. Principal – Technical Category Sourcing Manager – OSAT & Substrate to set and drive global sourcing strategy in partnership with Engineering—owning supplier selection, commercial negotiations, and product cost models across our outsourced semiconductor assembly and test (OSAT), advanced packaging, and package substrate supply base. 

This role owns the end-to-end commercial relationship with OSAT partners, substrate suppliers, and their sub-tier raw material sources—from sourcing strategy and RFQ through pricing, contracting, capacity assurance, and cost roadmaps—across advanced packaging platforms including flip-chip BGA, 2.5D/3D integration, chiplet-based multi-chip packages, and high-layer-count ABF substrates. 

This is a highly cross-functional role working closely with Package Engineering, Test Engineering, Operations, Quality, Finance, and Legal to secure capacity, qualify new suppliers, and deliver cost and supply-continuity commitments through NPI and high-volume production. 

A core focus of this role is staying ahead of the technology pipeline: as our silicon moves to advanced process nodes and increasingly complex multi-chip packages, you will secure the assembly, test, and substrate capability—and the sub-tier raw materials behind it—well before those platforms reach production. 

Success in this role requires a strong balance of technical acumen, business savvy, and the ability to execute against strategic objectives—translating engineering requirements into sourcing decisions, and sourcing strategy into measurable cost, capacity, and continuity outcomes. 

A Day in the Life 

In this role, you will: 

• Set and drive global sourcing strategy for OSAT, advanced packaging, and substrates in partnership with Engineering 

• Lead RFQs, pricing negotiations, and commercial agreements with OSAT and substrate partners 

• Secure capacity, tooling, and NRE commitments ahead of demand inflection points 

• Build and maintain product cost models and defend annual cost-reduction roadmaps 

• Qualify and develop second-source suppliers to de-risk single-source packages 

• Partner with Package and Test Engineering to source emerging advanced packaging and multi-chip package technologies 

• Map the advanced packaging and advanced process node roadmap to supplier capability and capacity gaps 

• Engage sub-tier substrate suppliers to secure ABF film, copper foil, and other critical raw materials 

• Negotiate LTAs, capacity reservation agreements, and pricing structures alongside Legal and Finance 

• Drive supplier business reviews, scorecards, and escalation of commercial and supply issues 

Key Responsibilities 

Category Strategy & Supplier Selection 

• Set and drive the global sourcing strategy for OSAT services (assembly, test) and package substrates (ABF, BT, organic interposer) in partnership with Package and Test Engineering 

• Build alignment with Engineering, Operations, and Finance on category strategy and execute against multi-year strategic objectives 

• Segment the supply base and define single-, dual-, and multi-source strategies by package family and technology node 

• Lead supplier selection, RFI/RFQ, and award decisions in partnership with Package and Test Engineering 

• Benchmark the OSAT and substrate landscape, tracking technology roadmaps, capacity additions, and regional footprint 

Advanced Packaging & Emerging Technology Sourcing 

• Partner with Package Engineering to source emerging advanced packaging platforms, including 2.5D/3D integration, chiplet-based multi-chip packages, and high-density organic and silicon interposers 

• Translate the product roadmap at advanced process nodes into assembly, test, and substrate capability requirements and sourcing plans 

• Identify and qualify suppliers with the technology roadmap, equipment, and capacity to support next-generation package architectures 

• Negotiate development, prototype, and qualification terms for pre-production advanced packaging technologies, including NRE, tooling, and test development 

Commercial Negotiation & Contracting 

• Lead pricing, tooling, NRE, and capacity negotiations with OSAT and substrate suppliers 

• Negotiate and manage MSAs, LTAs, capacity reservation agreements, and pricing addenda with Legal and Finance 

• Structure commercial terms covering yield, scrap, material liability, lead time, and cost-down commitments 

• Serve as the primary commercial point of contact and escalation path for assigned suppliers 

Product Cost Modeling & Cost Management 

• Build and maintain product cost models spanning substrate, assembly, test, and yield, and keep them current as designs, nodes, and supplier pricing evolve 

• Maintain should-cost and total-cost-of-ownership models for assembly, test, and substrate to benchmark supplier quotes and award decisions 

• Develop and deliver annual cost-reduction roadmaps tied to yield, test time, panel utilization, and design-for-cost initiatives 

• Partner with Finance on standard cost, purchase price variance, cost forecasting, and budget planning 

• Drive cost transparency across substrate layer count, body size, test insertions, and key material inputs 

Capacity Assurance & Supply Continuity 

• Secure assembly, test, and substrate capacity aligned to product roadmaps and long-range demand 

• Negotiate capacity corridors, pre-buys, and tooling investments ahead of ramp 

• Establish continuity and dual-source plans for single-source packages and long-lead substrates 

• Partner with Planning on allocation decisions and recovery plans during constrained supply 

Sub-Tier & Raw Material Security 

• Map the substrate supply chain to its sub-tier sources, including ABF film, copper-clad laminate, copper foil, prepreg, and carrier materials 

• Engage directly with sub-tier material suppliers to secure allocation, lead times, and reserved capacity for constrained raw materials 

• Track sub-tier capacity expansions, qualification status, and single-source exposure across the substrate value chain 

• Build raw material continuity plans—buffer stock, pre-buys, and alternate material qualification—with substrate suppliers and Package Engineering 

Supplier Performance & Development 

• Own supplier scorecards and quarterly business reviews covering cost, delivery, quality, and responsiveness 

• Drive corrective action and continuous improvement with Quality and Engineering on supplier issues 

• Develop emerging OSAT and substrate suppliers to expand qualified capacity and technology options 

• Manage supplier risk including financial health, geographic concentration, and sub-tier material exposure 

NPI & Cross-Functional Partnership 

• Engage early in NPI to influence package and test architecture decisions for cost and sourceability 

• Secure prototype, qualification, and ramp capacity and commercial terms for new products 

• Partner with Package Engineering, Test Engineering, Operations, and Quality on supplier qualification plans 

• Align with Product and Finance on cost targets, margin impact, and sourcing assumptions for new programs 

Basic Qualifications 

• Bachelor’s degree in Engineering, Supply Chain, Business, or related field 

• 12+ years of experience in strategic sourcing, procurement, or supplier management within semiconductor, OSAT, or electronics manufacturing 

• Direct category experience sourcing OSAT services (assembly, test) and/or package substrates 

• Deep working knowledge of advanced packaging technologies (e.g., flip-chip BGA, 2.5D/3D integration, chiplet-based multi-chip packages, high-layer-count ABF substrates) and wafer sort/final test flows 

• Experience managing sub-tier (n-tier) suppliers and securing constrained raw materials such as ABF film, copper-clad laminate, and copper foil 

• Experience sourcing for products at advanced process nodes and for new package architectures ahead of production release 

• Proven track record negotiating complex commercial agreements (LTAs, capacity reservations, pricing, NRE/tooling) with Asia-based suppliers 

• Proven ability to build and maintain product cost models, should-cost analyses, and total-cost-of-ownership models 

• Demonstrated balance of technical acumen and business judgment, with a track record of executing against multi-year strategic objectives 

• Experience with ERP and procurement systems (e.g., SAP, Oracle, NetSuite) and sourcing processes (RFQ, award, supplier qualification) 

• Excellent cross-functional communication and executive-level stakeholder management skills 

Preferred Qualifications 

• Advanced degree (MBA or MS in Engineering, Supply Chain, or Business) 

• Experience in AI infrastructure, cloud hardware, or high-speed interconnect ecosystems 

• Established relationships across the OSAT and substrate supplier base in Taiwan, Korea, Japan, China, and Southeast Asia 

• Experience standing up new suppliers and qualifying second sources in a high-growth fabless environment 

• Familiarity with advanced packaging cost drivers, substrate panel economics, and test-time reduction levers 

• Exposure to emerging packaging platforms such as panel-level packaging, glass substrates, or co-packaged optics 

Why Join Us? 

• Own the OSAT, advanced packaging, and substrate category for mission-critical AI infrastructure silicon 

• Play a central role in scaling the back-end supply base during a period of hyper growth 

• Set the sourcing strategy for next-generation multi-chip packages alongside engineering, product, and operations leaders 

• Operate in a fast-paced environment with high impact on cost, margin, and supply continuity 

• Competitive compensation, equity, and benefits 

Base salary range is $190,000 to $240,000 depending on experience, level, and business need. This role may be eligible for discretionary bonus, incentives and benefits.

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