焊线工艺&设备工程师/Wire Bond Process and Equipment Engineer
Texas Instruments · Chengdu
- 岗位职责：
- 1. 兼顾Wire Bond（引线键合）工序工艺管控+设备运维全模块工作；
- 2. 负责金线/铝线/铜线焊线制程参数优化、量产良率管控、打火不良、断线、拉力不达标等工艺异常整改；
- 3. 负责焊线机台日常保养、故障维修、设备校准、机台稼动率提升；
- 4. 完成焊线工序新产品导入、工艺验证、工艺文件编制；
- 5. 统筹焊线工序工艺和设备类问题闭环，推进产线标准化落地。
Why TI?
- Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
- We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
- Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here
About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.
If you are interested in this position, please apply to this requisition.
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