塑封工艺工程师/Molding Process Engineer
Texas Instruments · Chengdu
- 岗位职责：
- 1. 负责半导体Molding（环氧塑封）工序全流程工艺管控、参数优化、量产制程维护；
- 2. 解决塑封工序溢料、空洞、分层、翘曲、封装开裂等工艺量产不良；
- 3. 负责塑封料物料验证、固化工艺优化、产品外观及电性一致性管控；
- 4. 编制塑封工序工艺标准、生产管控文件，推进制程能力CPK提升；
- 5. 参与封装产品结构评审、新产品塑封方案落地与试产跟进。。
Why TI?
- Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
- We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
- Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here
About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.
If you are interested in this position, please apply to this requisition.
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